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    Moving toward the future of line connectivity at SMT Hybrid Packaging
    Foto: Zulfugar Karimov / Unsplash
    Products

    Moving toward the future of line connectivity at SMT Hybrid Packaging

    KIC announced their co-exhibition with SmartRep at the SMT Hybrid Packaging show and will discuss ‘Closing the Loop’ with the company’s Eco-system.
    Veröffentlicht
    23. Mai 2018
    Lesezeit
    1 Minute
    Rubrik
    Products

    KIC announced that they will co-exhibit with SmartRep at the upcoming SMT Hybrid Packaging show, scheduled to take place June 5–7 at the Messe in Nuremberg, Germany. The company will discuss ‘Closing the Loop’ with the company’s Eco-system. These systems work together to help run a production more effectively from NPI through manufacturing and traceability data.

    The Eco-system includes:

    • Reflow software to identify optimal oven setup for new products prior to running manual profiling
    • Automatic profiling for continuous in-spec reflow
    • Automatic process control to eliminate manual tasks and mistakes
    • Data analytics for more effective production
    • Central database data management with improved yield troubleshooting, ability to share URL pages for effective communication with all relevant personnel, and process and production traceability
    • Connectivity with MES and inspection machines

    The company makes it easy to get started with their Smart Factory Kit, which includes an SPS Smart Profiler, RPI Automatic Profiling System, and Vantage factory level connected database and data management system.

    Move toward the future of line connectivity, flexible production, data analytics, process transparency, machine learning, and real-time insight.

    SMT Hybrid Packaging, Booth 4A-230

    www.kicthermal.com

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