Stress-free air cushion transport within the machine ensures gentle handling and processing of extremely fine, virtually paper-thin substrates. With this setup, even back-wired substrates (BOC) are processed problem-free. Also, in another substantial process improvement, the transport is carried out over a preheated surface, which saves additional heating time and thereby enlarges throughput. A major factor enabling the increased throughput of the system is dynamic temperature control (DTC). Since the material within the molding channel has a longer curing time than in the formed part, the molding channel is heated to a significantly higher temperature. This causes the material inside the channel to cure in the same time as in the final part.
Especially thin parts extending over a large-area tend to waviness during the enveloping step. This may complicate their processing. Controlled temperature step-down under pressure now yields parts of extreme planarity upon leaving the ASM-W, which makes it much easier to further process them. Finally, active air release enables multi-chip modules (MCM), stacked die and flip chips with underfill to be evenly and securely enveloped with a large process window. The molding system dynamically controls the pressure in the forming cavity as a function of the transfer position by means of cavity vacuum control (CVC). With these performance features, Fico’s AMS-W is able to mold the most complex array products in a cost-efficient and reliable way.
EPP Europe 429
