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    Startseite/Events-tutorials/Artikel
    Mirtec unveils new hybrid 3D AOI System
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    Events-tutorials

    Mirtec unveils new hybrid 3D AOI System

    Mirtec, a provider of inspection technology, showcased its new ART Hybrid 3D AOI System in Anaheim in April. Referred to by the company as the first 75MP
    Veröffentlicht
    25. April 2024
    Lesezeit
    2 Minuten
    Rubrik
    Events-tutorials

    The system‘s approach involves complementary image acquisition of its five 15MP cameras. In scenarios where one camera faces light saturation due to reflective surfaces, the system seamlessly utilizes the data from the other cameras to restore precise 3D shape images. This revolutionary design allows the system to precisely measure 3D data at the very point where solder meets the component terminals. This has long been a challenge for conventional 3D AOI systems. Instead of providing REAL 3D Data, competitive systems with simply ‘fill-in’ absent data using software algorithms. This unique capability to accurately measure and characterize solder joints and reflective surfaces sets ART apart in the industry

    3D laser scanner for increased productivity

    The company also displayed two MV-6 OMNI 3D AOI machines at APEX 2024. The first system features a specialized 3D Laser Scanner attachment called TAL 3D SCAN. This design integrates directly into the PCB transport system of the MV-6 OMNI for precision 3D inspection of tall components prior to transport into the MV-6 OMNI System. The attachment scans waiting PCBs on the first stage while the MV-6 OMNI processes PCBs on the second stage. This innovative approach provides a 30% increase in productivity for mixed THT-SMT PCB manufacturing.

    The second MV-6 OMNI machine showcases a CXP-12 data transfer interface (CoaXPress 2.0), providing double the data transfer rate for lightning-fast processing speeds.

    www.mirtecusa.com

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