LPKF’s MicroLine Drill 600 allows small and medium-sized PCB manufacturers to meet the growing demand for high-density interconnect (HDI) PCBs with microvias and ultra-fine printed conductors. This is the unique feature: in addition to laser drilling of microvia, this tool provides for structuring of ultra-fine conductors directly into copper or resist, and therefore has the capability to produce, for example, ultra-fine solder-stop masks. Moreover, the machine can also cut assemblies mounted on flexible and rigid PCBs. Companies previously unable to operate a laser driller economically can now adopt multiple applications to achieve return-on-investment quickly. The equipment processes a wide range of standard materials, as well as ceramics with metal cores or thick copper coatings. As may be expected for a tool capable of producing small microvia down to 50µm diameter and conductor of 25µm width, the precision unit features a positioning accuracy of ±10µm. The automated handling system can process up to 25 PCBs sequentially. With precise positioning by a vision system, PCB manufacturers are enabled to implement an automated production of small to medium-sized batches of HDI boards.
