The following keynote speeches will be given: BioMEMS packaging, Marc Madou, University of California/USA; accelerometer technology developments, Andreas Wild, Freescale Germany; Fred von Roosmalen, Philips Semiconductors/NL, on integration techniques; Krishnendu Chakrabarty, Duke University/USA on synthesis and reconfiguration techniques for digital microfluidics-based biochips. Other subjects are advanced MEMS processes and technologies; MEMS and MST packaging; functional integration and devices, materials and their characterization; nano structures and devices; assembly and interconnect; reliability, test and quality of microsystems; design and simulation, etc. “Packaging has been regarded often as a necessary, but non-value added- process”, Herbert Reichl points out. “With microsystems, packaging will bring in a paradigm shift. With sensors, generic MEMS devices and actuators combined with powerful electronics, a functional package will bring down the cost of the final system, increase its performance and provide an easy-to-use handling format. The full synergy of such a combination can only be achieved if the packaging process becomes an integral part of the product design. The future level of hetero-system integration will include new concepts, materials, processes, design suites, simulation tools and new technologies. Those are now under development”.
EPP EUROPE 412
