The series of thermal-transfer labels consist of a top-coated semi-gloss polyimide film featuring an aggressive permanent acrylic adhesive, and are backed with a dust-free polyliner. The labels are suited for marking components, and the top/bottom sides of printed circuit boards to undergo lead-free and high-temperature solder processing up to 290 °C. They are especially designed for ultra solvent and heat resistance in through-hole and SMT processes, which require utmost durability. The label material provides excellent scratch, abrasion, chemical and heat resistance when printed with the company’s TTRR-B Series resin ribbons.
EPP Europe 414
