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    Startseite/Applications/Artikel
    Metrology Tool Offers Atomic Layer Measurement Accuracy
    Foto: Sahand Babali / Unsplash
    Applications

    Metrology Tool Offers Atomic Layer Measurement Accuracy

    A non-destructive, nanotechnology weight metrology tool handles high volume production of 300 mm semiconductor wafers. The Mentor DF3 has also been
    Veröffentlicht
    18. Mai 2006
    Lesezeit
    1 Minute
    Rubrik
    Applications

    Capable of throughputs in excess of 60 wafers per hour, Mentor DF3 tool has a small-footprint of only 2 m² and provides nanotechnology weight measurement of product, test and blanket wafers independent of substrate size or material. Mentor DF3 is designed to monitor changes in process performance and quickly determine whether device manufacture process steps are operating correctly. This tool enables process changes to be reliably and accurately determined after deposition, wet or dry etch or CMP processing.

    www.metryx.net

    EPP EUROPE 449

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