A key feature of the InCarrier process is its precise and inexpensive device alignment yield excellent open short rates even at device I/O pitches as low as 0.35mm. Another unique advantage is that it allows scaling test parallelism from 16x up to 144x devices just by adding microphone stimulus modules. At this high level of test parallelism jam rates can be as good as 1 in 144k devices resulting in unprecedented overall equipment efficiency (OEE) and very low operator requirements for the test cell.
The microphone MEMS module can be replaced on the InStrip base handler by any of the other MEMS modules of the company – InFlip, InGyro, InPressure – and support single insertion test of 3, 6 or 9 DOF combo sensors (acceleration, gyro, and magnetic sensors) or (tire) pressure sensors. Replacing the MEMS module by a contactor unit, makes the InStrip® base handler ready for standard IC package test.
Together with LTX-Credence the company can provide turnkey test cell solutions including test handler, contactors, DUT board and tester. Upon request the complete test cell can be integrated at Multitest facilities to warrant for minimal time-to-production in the startup process.
