The system can be used bottom-up for volume measurement of THT solder joints and pin height measurement, or Top-Down for a 150mm + clearance for 3D THT components measurement – making it the first compact 3D AOI system truly capable of inspecting THT solder joints and components with precision.
SpectorBOX X delivers direct volumetric measurements of solder joints from Selective, Wave, Robotic, Pin-in-Paste Reflow, Laser and Manual soldering systems in addition to accurate pin height measurement. The compact 3D modular AOI offers a clearance of 150mm (5.9″) and beyond on the THT components side and over 100mm (3.9″) on the THT solder side to accommodate most conveyor designs. The X, Y and Z-axis moving optics ensure inspection of most pallet designs.
With effective shadow and high reflection suppression, along with high repeatability rates in 3D volumetric measurements, the SpectorBOX X1 redefines quality control standards, all while maintaining a highly competitive price point. Its compact design, separate control box, and I/O options make it easy to integrate into existing conveyor systems.
In THT assembly lines, where custom-built solutions and handling systems for dedicated products are the norm, standard SMT AOI machines fall short due to size, weight, clearance, and environmental conditions. The modular platform offers a customizable solution, making it adaptable to the unique production environment. Many integrators have already successfully incorporated Mek’s modular AOI into complex THT production lines.
