High-efficiency pick and place solution
“Mechatronika’s M10V pick and place system is a versatile automatic machine for placing SMT components from 0201 to 40 mm x 40 mm with a full vision, touchless component centering,” the company said. “The excellent price to performance ratio makes [the system] perfectly suited for small scale production lines and prototyping.”
The company explained that a unique feature of the system is its ability to pick-up bulk (loose) components from container-type feeders. M10V built-in intelligent vision system enables to locate required component, pick it up, determine its position on the nozzle head and precisely place it on pre-programmed position. M10V accepts any number of bulk component feeders that can fit within its working space. Additionally, it can be equipped with the optional glue/solder paste dispensing head.
Soldering technologies
The MR260 convection reflow soldering systems uses re-circulated hot air to accomplish reflow at much lower temperatures than IR systems. Using constant, even heating, a great variety of board sizes will reach reflow temperature with the same heat profile.
Forced air convection heat to maximum temperatures up to 280°C. The forced air convection provides uniform heating and prevents shadowing. The reflow oven features Three heating zones and one cooling zone; each independently controlled for accurate temperature profiles. Digital PID regulators ensure high stability of each zone temperature. All heating parameters and registered profiles can be easily observed on built-in 17“ LCD display. Temperature profiles can be logged and analysed using the integrated 4-channel data logger and software. The USB connector allows downloading recorded profiles to an external PC.
