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    Material for thermally conductive cores and prepreg for multi-layer and hybrid build ups
    Foto: Blaz Erzetic / Unsplash
    Products

    Material for thermally conductive cores and prepreg for multi-layer and hybrid build ups

    Ventec International has thermal management solutions, including material for thermally conductive cores and prepreg for multi-layer and hybrid build ups.
    Veröffentlicht
    01. September 2017
    Lesezeit
    1 Minute
    Rubrik
    Products

    Ventec International Group, a producer of polyimide & high reliability epoxy laminates and prepregs, has a range of thermal management solutions that includes the latest advanced material for thermally conductive cores and prepregs for multi-layer and hybrid build ups. The company‘s IMS materials deliver an exceptional thermal performance, reliability and quality, and particularly demanded by automotive and other LED lighting and DC power conversion applications.

    The VT-5A2 is a next generation, high Tg thin-core and prepreg material. It is designed for the most thermally demanding PCB applications such as power converters, hybrid multilayers and high-power electronics with heavy copper designs providing enhanced signal stability in harsh environments. With a thermal conductivity 8 times that of FR4, this prepreg material delivers high flowability for perfect encapsulation, allowing for better board design for applications requiring critical thermal management in harsh environments. It is manufactured by using strict quality controlled processes that are certified to AS9100 Revision C, ISO/TS16949, and ISO 9001:2015.

    Jack Pattie, President of the company’s American office comments: “E-vehicles and hybrid vehicles are a huge business for us and we expect there to be a lot of interest in our solutions, particularly our new products.”

    www.venteclaminates.com

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