Nordson Yestech, a subsidiary of Nordson Corporation and a supplier of automated optical and conformal coat inspection systems for the electronics industry, is pleased to announce that Trenton Technology has installed two FX-940 Ultra 3D AOI systems at its Utica, NY facility. Trenton designs, manufactures and integrates rugged rackmount computers using long-life system components and PCI Express device interconnect technology.
Edward Wheeler, Director of Manufacturing Engineering at Trenton Technology Inc., commented, „We build a wide range of boards for our customers in terms of volume and complexity, from electronics for toys with relatively few placements, to aerospace applications with thousands of placements, and everything in between. We needed a way to ensure that component and solder joint inspection was always being done in a consistent way, and that‘s where the 3D AOI machines come in.
The system provides high-powered inspection with an unmatched false call rate. “As an early adopter of the 940 3D systems coming from the FX platform, we were concerned that the increased complexity of 3D inspection was going to slow down the process and were devising plans to use it only where needed. We were pleasantly surprised that not only does the 3D run far faster than anticipated, the coverage is dramatically improved compared to the 2D system we were used to, and have expanded the 3D inspection far beyond our initial expectations.”
Wheeler added, “As always, working with Yestech to customize the software and data collection to fit our needs was easy and efficient, making us glad we were dealing with a US-based company. We build a lot of products that the customer wants shipped out without going through a functional test, and the 940 3D lets us achieve a high level of assurance that the product is being sent out properly manufactured, every time. As far as I‘m concerned, it is by far the best bang for the buck when it comes to automated inspection equipment.“
With its 3D AOI systems, the company is able to provide its customers with cutting-edge 3D technology for the inspection of solder defects, lead defects/lifted leads, component presence and co-planarity of chips, BGAs and other height sensitive devices.
