Nordson Dage, Matrix, and Yestech, divisions of Nordson, today announced that they will exhibit at the upcoming SMT Hybrid Packaging scheduled to take place May 16–18 at the Messe in Nuremberg, Germany.
Dage will demonstrate their flagship system – the new Quadra 7 with 0.1 μm sub-micron feature recognition which comes equipped with two 4K UHD displays and 8 million pixels to fully show the 50 μm pixel pitch and 6.7 MP image size of the Aspire FP detector.
The Quadra 5, with will also be showcased. This system offers high performance and ease of use for 2D and 3D X-ray applications. 0.35 μm feature recognition up to 10 W of power, makes the Quadra 5 the leading choice for printed circuit board and semiconductor package inspection.
Matrix– an automated inline X-ray inspection, complements its existing application spectrum of SMT and PTH solder joint inspection with power hybrid applications (e.g. IGBT), battery inspection and wire bond testing. By focusing on these applications, Matrix answers the increased demand for more safety and quality inspection of consumer products like smartphones or earphones. The flexible configuration of its inline systems offers maximum possibilities to adapt to customer specific needs as one can choose between different inspection technologies (2D Transmission, SFTTM, 2.5D Off-Axis, 3D SART) depending on the actual inspection demand.
Yestech FX-940 ULTRA 3D AOI with cutting-edge 3D technology is ideal for the inspection of solder defects, lead defects/lifted leads, component presence and co-planarity of chips, BGAs and other height sensitive devices. With its Advanced Fusion Lighting and comprehensive inspection technologies including angled cameras, full-color digital image processing and both image and rule-based algorithms, it offers complete inspection coverage with unsurpassed 2D and 3D defect detection.
SMT Hybrid Packaging, Booth 4–214
