In a move to help improve yields in semiconductor processing, Junkosha – producer of fluoropolymer application technologies – has announced the development of its Super Low Outgassing cable, providing a high performing cabling in the microprocessor clean room sectors.
With the need for reduced outgassing derived from production and machine processes in the cleanroom and UHV environments increasing, microchip manufacturers are being called upon to develop more and more cleaner products for a wider set of applications. Alongside the move to a 5G world, where there will be a huge increase in the number of devices entering onto the networks, reduced outgassing throughout the chip manufacturing process will be a necessity.
According to Shinsuke Kitazawa, the High Flex group leader: “Our flexible SLO cable not only addresses our ambition to deliver best in market solutions, but importantly meets the demands imposed on the semiconductor manufacturing industry itself which is under constant pressure to improve yield quality and minimize any potential contamination through volatile outgassing.”
The launch of SLO was timed to coincide with Semicon Europa 2018 and follows a recent call by the company for the international semiconductor industry to increase collaboration on outgassing standardization across the sector, to include the essential cabling and interconnects, integral to sophisticated microchip manufacturing processes.
According to Kitazawa, the cable reaches the target vacuum level (BackGround level) in half the time compared with the conventional Low Outgas cable (ePTFE). This is an important breakthrough in the components sector, especially in the context of the International Technology Roadmap for Semiconductors, where Moore‘s Law can only be realized through consistent yield improvement and related productivity upgrades.
„SLO is in answer to the increasing demands of the industry. Our exhaustive tests across a comprehensive set of scenarios in vacuum chambers have demonstrated impressive results“
Growth of production in 200 and 300 mm fabs is fuelled by development of the Internet of Things (IOT) and the proliferation of digitalization will continue to increase demand for integrated circuits (ASICs), analog ICs, high-performance components and micro-electrical mechanical sensors (MEMS), all demanding efficient production processes, including the mitigation of contamination wherever possible.
Joe Rowan, President and CEO of the US and Europe branch explained, “Our focus on enabling innovation has allowed us to push the boundaries, and essentially leapfrog or outdistance competitors. This is testament to our integrated R&D, production, business development and sales teams, identifying product areas where we can excel through the application of our core, advanced PTFE Fluoropolymer technology to unmet market needs.
