The company manufactures laser stencils with a pad accuracy of ± 2 µm and thus provides optimal preconditions for production techniques such as solder paste printing or for instance µBGA or components of the size 01005 and adhesive printing. Laser-cut stencils are ideal for paste or adhesive printing, because the pads have a slightly conical aperture at the printed circuit board side and therefore, together with the electro polishing procedure, the stencils ensure optimum release behaviour of the paste. On request, solder paste stencils can be provided with different step heights or depths at the squeegee-and/or PCB side. The main offer includes laser-cut stencils in fixed frames and with seating or perforated edge for self mounting systems, certain SMD stepped stencils for the optimal adjustment of solder paste volume with mixed assemblies or for compensation of substrate unevenness, combined with different surface optimisations such as the electro polishing procedure. Furthermore the company offers nickel laser-cut stencils, pump-print stencils, electroplated and etched metal stencils.
For the EPP-Benchmark Arena the Christian-Koenen GmbH provides laser-cut precision stencils. In order to achieve an optimal printing the stencils are adjusted most accurately and are provided with appropriate options. Included into the stencils are step heights from 80 to 120 µm. The surface and the aperture walls are being treated with an electro-polishing procedure; in addition, the stencils are being provided with a nano-coating. Thus the release behaviour of the paste is being optimised and a print layout with a sharp outline is being resulted. Another service stress is process consultation. In April 2008 the Koenen group Application Center has been put into operation. It will be available to the customers and partners of the company for printing trials and research tasks. Process optimisation can be performed based on customer parameters and materials. Through its multitude of variables and influence factors the printing process at the start of the line constitutes the greatest improvement potential of the line. In interaction, stencil, equipment, printing parameters, material, operator and environmental factors decide the printing quality. A significant reduction of the manufacturing tolerances can be achieved through targeted optimisation of the customer-specific parameters. The Koenen group takes over these research tasks for process optimisation on behalf of its customers. In the case of problems with components for example, customers can send the circuit boards and the soldering paste used to the Koenen group where, by means of different stencil layout versions and production parameters, printing tests are conducted. The optimal parameters determined are stored and incorporated in the individually manufactured stencil of this specific customer in future. This optimal adaptation of the stencil parameters creates the basis for stable and reproducible manufacturing processes. Adaptation of the process parameters will become a necessity in future more so since increasing miniaturisation increasingly moves the printing process into borderline areas. An added advantage to the customer is the “outsourced” process optimisation, no cost-intensive test and idle times in the line are incurred. Thus productions gain additional valuable production times. Obviously, training and process optimisation services will also be conducted “on site” if requested. A portfolio of selected products, comprehensive process consultation, special procedures, precise stepped stencils and services such as the 6-hour production service, the electropolishing process, delf mounting systems of leading manufacturers, storage systems and the company’s own SMD-cleaner series „cleanteCK“ complete the offer.
SMT, booth 8-109, 7-639
EPP Europe 410
