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    “Jet” module increases SPI throughput and ROI
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    Products

    “Jet” module increases SPI throughput and ROI

    Parmi, a leader in 3-D solder paste inspection (SPI) of printed circuit boards announces the Jet Solder Jet Dispenser Unit for its award-winning Sigma X
    Veröffentlicht
    23. Oktober 2014
    Lesezeit
    1 Minute
    Rubrik
    Products

    “Insufficient or missing solder paste is a common process symptom,” says Jeff Mogensen, GM at the company. “Sigma X now eliminates the re-work and scrap associated with them by repairing them in the SPI machine.” This time-saving feature significantly improves yields and ultimately profitability,” Mogensen adds.

    With more than 2,500 installations worldwide, the company leads the industry in SPI performance and innovation. “Parmi and our Sigma X Series is the benchmark in solder paste inspection,” says Mogensen, “and we are pleased to showcase the Jet Solder Jet Dispenser Unit as further proof of our commitment to innovation and value-added product development.”

    www.parmi.com

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