“Building upon the past two conferences in Budapest, this conference will focus on how IPC standards can be used as a resource for improving quality, making better materials choices and achieving the ‘perfect’ solder joint,” said Lars Wallin, IPC European representative and conference presenter. “New this year and as an added bonus, our panel of invited technical experts will present case studies so attendees can learn about real solutions through first-hand experiences.”
This year’s technical conference will cover a wide range of topics including: design and process control for package-on-package assemblies, solder paste selection in lead-free processes, measuring printed solder paste volume, avoiding solderability problems in bare boards, parameters for surface finish selection, placement and reflow in solder joints, and the effects of heat and moisture on passive and active electronic components. In addition, industry experts will provide insight into EMS growth in central Eastern Europe, environmental trends and legislation, and relevant industry standards to use throughout production.
Preceding the conference, workshops will be held in the morning on 6 February. Dr. Thomas Ahrens, Trainalytics GmbH, will address lead-free solder joint rework and repair; industry consultant Bob Willis will address printed board inspection and quality control for BMC, LGA and QFN designs and steps for practical failure analysis; IPC European Representative Lars Wallin will provide information on solder joint troubleshooting and demands for producing IPC Class 3; and IPC Director of Government Relations and Environmental Policy Fern Abrams will cover conflict minerals. The event will also feature tabletop exhibits.
