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    Startseite/Productronica-2017/Artikel
    Introducing first module for reflow oven monitoring
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    Productronica-2017

    Introducing first module for reflow oven monitoring

    ECD will display its thermal profiling technologies, including their wave soldering test pallets and reflow oven performance verification tools.
    Veröffentlicht
    30. Oktober 2017
    Lesezeit
    2 Minuten
    Rubrik
    Productronica-2017

    At this year’s productronica, ECD will display its thermal profiling technologies, including the M.O.L.E. thermal profilers, wave soldering test pallets, and reflow oven performance verification tools. In addition, the company plans to debut a scalable monitoring system designed to provide continuous oversight and customizable data analysis for various SMT thermal processes. The first module centers on reflow oven performance and output optimization.

    The thermal profiling range includes 3-, 6– and 20– channel options to address the various requirements of standard SMT through to complex, high-value assemblies. The MEGA M.O.L.E. 20 profiler is for demanding, high-complexity boards and R&D work. The SuperM.O.L.E. Gold 2 with six channels of powerful profiling capability is ideal for OEMs and EMS providers that need reliable performance and versatility. There is also the V-M.O.L.E. available, which provides value and verification in an easy-to-use three-channel system. Along with the profiling portfolio, the company’s process test pallets will also be demonstrated, including the WaveRIDER, OvenRIDER NL 2+, OvenCHECKER, and Fluxometer.

    “M.O.L.E. is the industry’s original thermal profiling system, developed by ECD over three decades ago when we were the first to recognize the technology need,” says CEO, Todd Clifton. “Since then, our expert team has continued M.O.L.E.’s engineering evolution, always progressing and perfecting our approach to thermal process optimization.”

    The company’s history and expansive thermal processing knowledge is at the foundation of their latest innovation, a continuous process monitoring system set to be introduced this year at productronica. Bypassing current market solutions, the monitoring technology adds new levels of control, customization, scalability, trend identification, and in-process product visibility for high-yield, cost-effective results. The company will introduce the first module for reflow oven monitoring.

    “ECD continues to lead the market with meaningful technology innovation – delivering products that help reduce cost, raise productivity and improve yield,” says Clifton in summary. “Our latest development underscores this approach and we look forward to demonstrating its effectiveness for productronica visitors.”

    productronica, Booth A4.532

    www.ecd.com

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