“The unique side-view BGA Inspection system features the tiniest and most robust optical probe available with built-in high power lighting and a crisp, sharp high-resolution 90-degree viewing angle,” the company said.
The BGA-007 probe footprint itself, resembling an inverted periscope, offers a footprint that is 6.0mm long by 0.8mm deep, with a height of 1.5mm. The system produces high-resolution images of the extremely low-clearance areas beneath BGAs, μBGAs, CSP, CGA and FlipChip packages with as low as 40 microns standoff. As such, it is an advanced solution for discovering micro-cracks, cold solder joints, whiskers, missing balls, scaling, excess flux and other soldering issues known to plague SMT/BGA assembly.
“The many advanced features in this system, complementing one another, make our BGA inspection system the most powerful and unique in its class,” Alistair Gooch, Marketing Manager at the company, said.
“Variable focus capability of the optics allows the user to image from the first to up to 20 rows of BGA solder bumps with its flexible, electronically dimmable high-power LED fiber brush light as background illumination. The unique soft-touch mechanism design of the stand bracket protects the micro-prisms in the optical probe tip from damage when positioned on the surface of the PCB under inspection.
“The probe can be ordered as a spare to add extra flexibility to existing systems or can be supplied with our popular kits fitted with this as an alternative to the standard normally supplied.”
“The new inspection system features a 5.0 megapixel USB3.0 digital microscope and integrated micro-prism background light mounted on a compact, robust stand with an XY-translation stage. A 180-degree pivoting mechanism facilitates easy alignment of the probe along 3 different sides of the BGA package. The BGA Inspection system is available in 2 system levels, Basics and ProX including powerful Inspectis BGA Inspection, analysis and documentation software.”
