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    Inspection toolbox of a microelectronics AOI platform
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    Products

    Inspection toolbox of a microelectronics AOI platform

    Machine Vision Products (MVP) demonstrated their diverse inspection toolbox on the MVP 850 platform for microelectronics and packaging. Applications will
    Veröffentlicht
    21. Juli 2016
    Lesezeit
    1 Minute
    Rubrik
    Products
    • Die placement metrology
    • Wire bond
    • Epoxy spread and bridging
    • Lead frame integrity
    • 2D and 3D high-resolution imaging
    • Ball diameter, shape, offsets and damage
    • Coplanarity and height measurements
    • Die alignment metrology on the substrate
    • Edge, FM and surface
    • Flux and paste
    • Dice wafer inspection including:
    • Die metrology
    • Die surface and edge chips
    • Traceability products and image archiving

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    Heavy board options added to reflow soldering system
    Products

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    27. Mai 2025

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    New 3D AXI platform provides clearer imaging
    Products

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    22. Januar 2025

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    No-clean formula maximize the solderability
    Products

    No-clean formula maximize the solderability

    10. Januar 2025

    Indium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting

    Extensive program of testing options
    Products

    Extensive program of testing options

    10. Januar 2025

    Test Research, Inc. (TRI) will join the IPC APEX EXPO 2025 held at Anaheim Convention Center on March 18 – 20, 2025 at booth #2905 to show latest test and

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