In addition to helping manufacturers achieve a better bottom line through faster time-to-market and cost efficiency, the system offers further enhancements to help manufacturers address emerging technical challenges. For instance, low-contrast components have presented inspection issues industry-wide. The algorithms included in this AOI system are designed to bring greater image clarity to low-contrast components, providing the end-user with better defect analysis capabilities. The image clarity results in lower false-call rates and improved defect detection.
This AOI system is ergonomically advanced with significant user and system interfaces. According to the company, a key differentiator is the unparalleled flexibility inherent in the technology. It can be deployed in a 2D paste, pre-reflow, mixed-mode and post-reflow environment while quickly converting the optics head for inline 3D solder paste inspection. This flexibility offers manufacturers a system that can be easily deployed in a multitude of line positions for those sites that are new to AOI or those that are growing and have ever-changing needs.
Reportedly, both the Medalist SJ50 and SP50 Solder Paste Inspection systems integrate key enabling technologies for a degree of accuracy and flexibility not previously seen in AOI. Interchangeable lighting heads and the firm’s unified platform technology allow the systems to be redeployed at paste, pre- or post-solder as needs change. New techniques such as Solid Shape Modelling deliver the highest-resolution 3D images, while links to downstream repair stations and statistical process control tools allow better control over collected data.
electronica, booth A1.606
EPP Europe 445
