The YSi-X is a multi-function 3D X-ray hybrid-type inspection system capable of complete in-line inspection of all facets of printed circuit boards. Thanks to 2D/3D X-ray inspection function through newly and patented high-speed X-ray laminography imaging technology and multiple inspection functions utilizing optics and lasers. Because of this hybrid capability eliminates the need for a separate optical inspection unit necessary in conventional lines, the system also reduces overall investment for an SMT production line. The company will also showcase new feeding solutions for its YC8 odd-form final assembly station, including an advanced radial tape feeder and stack stick feeder for heavy components.
Productronica, Booth A3.323
