According to the materials manufacturer, the paste called NC38HF combines superior wetting performance with excellent stencil print transfer efficiency to satisfy the broadest range of process requirements for miniLED applications. It offers excellent printability down to 60-micron apertures. MiniLEDs typically feature a length of less than 240 microns on the component edge; this material offers excellent compatibility with the current size of miniLEDs and as future die continue to miniaturize.
The new LED paste delivers:
- Consistent and tight solder deposit spread across multiple prints and excellent response-to-pause characteristics
- Minimal voiding on tight-pitch components, ensuring joint strength on small components
- Industry-leading non-wet open (NWO) performance using superior oxidation barrier technology, enabling reduced solder ball and solder beading defects and enhanced graping performance
- Enhanced slump performance with minimal bridging during the assembly process, improving yields for tight-pitch components
