Indium Corporation is set to introduce its newest Heat-Spring pattern, the HSx. Designed for large area dies with warpage challenges and pressure limitations, HSx will be introduced at TestConX 2025, which will take place from March 3-5 in Mesa, Arizona.
A leader in high-performance metal thermal interface materials (TIMs), Indium Corporation will showcase the following solutions at the event:
Heat-Spring HSx, which features a new pattern designed for large area dies with warpage >200 microns, effective thermal conductivity of 16W/m-K at only 20psi with pure indium, and thickness ranging from 300 micron up to 1mm. The solution is designed for test heads where clamping forces are limited to <30psi and is available with or without a diffusion barrier to prevent staining of the die.
Heat-Spring HSD: designed for interfaces with tight surface control >30psi, this solution remains the original and best standard option for interfaces with flat, smooth, and parallel surfaces.
Heat-Spring high profile preforms, which are patterned to optimize contact with non-planar surfaces delivering 86W/mK. Ideal for assemblies with an extruded, unfinished heat-sink, the solution is recommended for immersion cooling and burn-in applications and provides uniform contact between the burn-in head and the DUT and more uniform thermal conductivity.
Heat-Spring HSK. This solution is recommended specifically for burn-in applications where multiple insertions are required. It provides uniform contact with low resistance for high-density heat loads. Typically clad with a thin diffusion barrier, which serves as the contact surface for burn-in and test applications, the solution has the advantage of eliminating staining or cracking.
All Heat-Spring products are recyclable and reclaimable.
To learn more about Indium Corporation’s metal TIMs for burn-in and test, visit our experts at Booth 45 at TestConX, or online at indium.com/TIMs.
