At PCIM Expo 2026, Indium Corporation will highlight its Formic Acid Soldering Technology (FAST) suite, comprising preforms, InFORMS reinforced solder preforms, and flux-free solder pastes designed for ultra-low-voiding reflow without post-reflow cleaning — a process advantage relevant to high-density power module manufacturing. InFORMS address bondline thickness consistency in package-to-cooler attach applications.
The company's sinter paste line includes InFORCE MF, a pressure silver sinter paste for SiC die-attach compatible with printing and dry-placement; InFORCE 29, a pressure copper sinter paste for Si and SiC die-attach and substrate-to-cooler attach; and InBAKE 29, a copper sinter paste engineered for pressureless batch-oven sintering in power discrete applications. AuLTRA die-attach preforms round out the portfolio, offering gold-based solutions with tight volume tolerances for critical high-reliability applications.
These materials target the growing demand for thermally and electrically robust interconnects in next-generation power electronics, particularly those supporting AI infrastructure hardware that relies on efficient power conversion and thermal management.
Quelle: Indium Corporation – https://www.indium.com/press-releases/indium-corporation-brings-ai-enabling-power-electronics-solutions-to-pcim-expo/
