The company produces a wide range of solder paste products to meet the current and evolving needs of the industry. High-power LEDs have the ability to provide much higher levels of light output than traditional LEDs while also providing higher levels of performance, leading to a longer lifetime of the device. Due to the large amount of heat generated—in such a localized area—a high-melting and high-reliability solder is required for assembly.
It is also critical to the LED assembly process that the solder interface between the diode and its substrate is void-free in order to generate a stable transmission of light and allow for the transfer of the tremendous heat generated by the diodes to maintain the temperature stability of the device.
AuLTRA 3.2 and AuLTRA 5.1 are AuSn solder pastes specifically formulated to accommodate higher processing temperatures while providing high reliability.
AuLTRA 3.2 offers:
- Water-soluble flux
- Air or nitrogen reflow
- Superb wetting
- Low-voiding
- Long open life, reduced waste
AuLTRA 5.1 offers:
- No-clean residue
- Air or nitrogen reflow
- Superb wetting
- Low-voiding
- Long open life, reduced waste
Both pastes are offered in a variety of AuSn alloys and powder sizes. In addition to being ideal for use in high-power LED module array applications, the two new pastes are applicable for all AuSn paste applications.
