According to the company, the paste known as SiPaste C201HF combines industry-leading non-wet open (NWO) performance with excellent stencil print transfer efficiency to satisfy the broadest range of process requirements and boost SPI yields. “It leaves behind a cleanable residue, able to be removed with a commercially available semi-aqueous cleaning solution, or it can be used as a standard no-clean paste in processes where post-reflow cleaning is not applicable.”
The paste features excellent transfer efficiency on fine feature apertures, with consistent process yields below 80μm and delivers:
Consistent and tight solder deposit spread across multiple prints; excellent response-to-pause performance
- Minimal voiding on tight-pitch components, ensuring joint strength on small components
- Excellent reflow performance on components that exhibit high warpage
- Enhanced slump performance with minimal bridging during the assembly process, improving yields for tight-pitch components
- Flexible cleaning; can be used in processes that require cleaning with a saponifier or that do not require cleaning
