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    Startseite/Applications/Artikel
    Increased process capability
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    Applications

    Increased process capability

    Conti Temic Microelectronic GmbH in Nuremberg specialises in the manufacture of highly complex electronic assemblies for the automobile industry. Soldered
    Veröffentlicht
    02. November 2012
    Lesezeit
    1 Minute
    Rubrik
    Applications
    • 1 W.B. Hance, Lee Ning-Cheng, Poreing Mechanisms in SMT, Soldering & Surface Mount Technology, 13, 1993.
    • 2 N. Zhu, Thermal impact of solder voids in the electronic packaging of power devices, Semiconductor Thermal Measurement and Management Symposium, p. 22–29, Fifteenth Annual IEEE, 1999.
    • 3 S.T. Nurmi, J.J. Sundelin, E.O. Ristolainen, T. Lepistö, (2003) „The influence of multiple reflow cycles on solder joint voids for lead-free PBGAs“, Soldering & Surface Mount Technology, Vol. 15 Iss: 1, pp.31 – 38.

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