Specially designed for long printed circuit boards, thus for LED lights as well, the company offers the long board option for inspection objects with lengths of up to 2000 mm. The S3088 SPI for solder paste inspection (3D SPI) and automatic optical systems S3088 ultra and S3088 ultra gold (3D AOI) are distinguished by very high measurement accuracy, speed and reliability in the intelligently networked quality inspection of electronic assemblies.
In addition to solder paste and solder joints, the systems with up to nine high-power cameras and true-to-life, three-dimensional image representation also measure the slightest component tilting, for example. An exact positioning down to a few micrometers is decisive for LEDs in the automotive sector, where LEDs find use in headlights, taillights and other applications. With the optical inspection, even the smallest scratches on LEDs are reliably detected.
Without the long board option, the standard 3D AOI and 3D SPI systems from Viscom permit the fully automatic inspection of printed circuit board lengths up to 508 mm in one piece. Its high throughput with inspection speeds of up to 65 cm2/s and an expansive field of view of 50 mm by 50 mm will make the S3088 ultra gold high-end configuration a standout during benchmarks. The S3088 ultra has also established itself as the ideal solution for very individualized additional requirements. These systems can inspect assemblies up to 660 mm long without add-on modules. Here, the inspection process takes place in two partial sections, which are merged as a total result on the verification station.
If the boards to be inspected are still longer, the inspection systems can be equipped and synchronized with optional external transport modules. In this case, the company offers three solution packages, specifically for inspection objects up to lengths of 1000 mm, 1500 mm and 2000 mm. The inspection can run in up to five partial sections; here too, the final results are digitally merged.
