The SQ3000 offers a combination of unmatched accuracy and speed with the Multi-Reflection Suppression (MRS) sensor technology that meticulously identifies and rejects reflections caused by shiny components and surfaces. Effective suppression of multiple reflections is critical for highly accurate measurement, making the proprietary MRS technology an ideal solution for a wide range of applications with exacting requirements.
The Ultra-High Resolution (UHR) MRS sensor enhances the SQ3000 platform, delivering superior inspection performance, ideally suited for the 0201 metric process and micro-electronic applications where an even greater degree of accuracy and inspection reliability is critical.
The system has been widely used for 3D Automated Optical Inspection (AOI) and can now be used for 3D Solder Paste Inspection (SPI) for the best accuracy, repeatability and reproducibility – even on the smallest paste deposits. Combined with the easy-to-use software, solder paste inspection has reached a new level of precision for the most stringent requirements.
Additionally, the SQ3000 can be used to attain highly accurate coordinate measurements faster than a traditional Coordinate Measurement Machine (CMM) – in seconds, not hours. The first in-line CMM includes a comprehensive software suite for use in industrial metrology, semiconductor, microelectronics and SMT applications.
Customers can use the 3D multi-function inspection and measurement system to improve yields, quality and operational efficiencies in their manufacturing facilities.
