The system performs effective power-down testing for most analog or digital assemblies being manufactured today quickly and easily testing through-hole and SMT circuit board assemblies for common manufacturing defects such as incorrect, missing or misoriented components, and opens and shorts. Equipped standard with TestJet Technology, Analyst can identify opens in and around most analog and digital IC packages. These faults comprise the vast majority of problems encountered in the today’s electronics manufacturing environment. The optional power-up functional test capability is ideally suited for lower frequency analog assemblies with some digital content.
The Analyst ils tests the entire unit-under-test (UUT) and individual components without power applied to the UUT. Using sophisticated measurement techniques such as DC or complex-impedance measurements in conjunction with multi-point guarding, ICT systems quickly and accurately measure continuity, capacitors, resistors, inductors, voltages, semiconductor junction voltages, and SMT connections for opens. By finding the majority of faults while the UUT is in the safe unpowered mode, together with very specific fault diagnostic messages, faulty UUTs can be repaired quickly.
