- Solder paste inspection
- Traceability (data matrix code and barcode)
- Placement inspection and control
- Solder joint inspection and
- Electronic final testing
- Expanding the field of view
- Quicker movement of the camera axis by using linear drives
- Camera “flashing” when moving and capturing the images
- Reducing the core cycle time permits more time for inspection
- Parallel process of stencil cleaning and inspection
- Stencil bottom side cleaning with the 3 mode types: dry, wet and vacuum
- Solder paste dispenser
- Temperature control
- Statistical process data capture
- Recognising and reading bar and data matrix codes
