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    Startseite/Applications/Artikel
    Improved methods
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    Applications

    Improved methods

    For the non-destructive quality control and failure analysis of copper-filled microvias and similar interconnections, such as TSV, 2D X-ray inspection
    Veröffentlicht
    05. Oktober 2011
    Lesezeit
    1 Minute
    Rubrik
    Applications
    • the features become smaller and cause less contrast in the 2D X-ray image
    • many structures may confusingly overlap and conceal each other in the 2D X-ray image
    • highly resolving inspection in three dimensions, that is nanofocus and microfocus computed tomography
    • improved signal-to-noise ratio in (real-time) X-ray imaging.

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    Under the motto “Assembling the Future”, Phonotronica Ltd. has been a pioneer in the development and manufacture of electronic modules since 1990.

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