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    Improve assembly process and equipment ROI
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    Products

    Improve assembly process and equipment ROI

    Parmi, a leader in 3-D solder paste inspection (SPI) of printed circuit boards (PCBs), showcased solutions for improving the assembly process and
    Veröffentlicht
    15. Juli 2016
    Lesezeit
    1 Minute
    Rubrik
    Products

    Sigma X – the award-winning machine that brings together innovative features for continuous process improvement and seamless data integration

    Printer Doctor- analyzes SPI data in real-time and communicates issues and corrective action before they become problems

    The Jet SPI Defect Repair – automatically adds missing solder paste to deposits with insufficient paste inside the SPI machine, to eliminate costly re-work and scrap

    With the company’s exclusive functionality built inside SPI equipment, there is no need to “just imagine” a better ROI on SPI ― the company is committed to helping manufacturers continuously improve production processes and yields so they realize a higher return on their investment. The company also presented a poster in the Apex exhibit hall entitled, “Screen Printing and SPI: Imagine SPI Beyond Good Board/Bad Board,” authored by Jeff Mogensen, General Manager, and Joe Perault, Technical Services Manager at the company.

    www.parmi.com

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