Both label families are suited for marking components and the top/bottom sides of printed circuit boards to undergo lead-free and high-temperature solder processing up to 290 °C. They are especially designed for ultra solvent and heat resistance in through-hole and SMT processes, which require utmost durability. Both items are available in white and in a light green.
TT403 comes with a 2 mil adhesive (total thickness: 7.5 mils), TT423 with a 2 mil adhesive (total: 5.6 mils).
Additionally, the latter is laid out for application on curved surfaces. Both label families provide very good scratch, abrasion, chemical and heat resistance when printed with thermal transfer resin-based ribbons.
SMT, hall 8, booth 309, hall 9, booth 634
EPP Europe
