- The Asterion Wedge bonder is built on an enhanced architecture that includes an expanded bond area, new robust pattern recognition capabilities and extremely tight process controls. Together these deliver heightened productivity, bonding quality, and reliability. The enlarged bondable area enhances flexibility and reduces line integration costs.
- The new configurable high power bond head addresses the industry’s growing and changing applications needs by handling a multitude of interconnect materials including large and small aluminum wire, copper wire, PowerRibbon, as well as aluminum copper-clad ribbon.
- PowerFusion – high performance semiconductor wedge bonder is driven by a new powerful direct-drive motion system and expanded pattern recognition capabilities which deliver industry-leading productivity and reliability.
- The iFlex T2 and H1 systems offer best in class flexibility, fast changeover and the lowest defect per million (DPM) rates in the industry. These advanced solutions can place all types of passive and discrete SMT components and also handle multifunctional and end-of-line placements.
- The Hybrid 3 is a multi-application solution for advanced packaging with one of the lowest DPM and highest throughput in the industry. It delivers a placement accuracy of less than 10 µm, making it ideal for wafer level packaging, FOWLP, SiP, MCM, flip-chip, modules and embedded components. Having evolved from the high speed AX/iX product family, the Hybrid 3 is highly capable of placing both die and passive component with a single machine.
