Zum Inhalt springen
EPP Europe
  • News
  • Products
  • Applications
  • Technology
  • Semiconductor
  • Inspection
  • Company News
  • Events
EPP Europe
  • Technology
  • Inspection (AOI/AXI)
  • Semiconductor Packaging
  • Company News
  • Products
  • Trade Shows & Events
    EPP Europe Newsletter
    The most important electronics-manufacturing news delivered to your inbox.

    Info

    • Impressum
    • Datenschutz
    • Barrierefreiheit
    • Datenschutzeinstellungen

    Kontakt zur Redaktion

    EPP EuropeKonradin Mediengruppe
    Ernst-Mey-Str. 8, 70771 Leinfelden-Echterdingen

    E-Mail: redaktion@konradin.de
    Folgen Sie uns
    EPP Europe
    © 2026 EPP Europe
    Startseite/Events-tutorials/Artikel
    Hungarian expo & conference almost doubles in size
    Bildquelle nicht angegeben
    Events-tutorials

    Hungarian expo & conference almost doubles in size

    The event, held for the electronics industry at the A-Hall of the Budapest Olympic Center from 23-25 April welcomed 2,497 professionals from 29 countries,
    Veröffentlicht
    15. Mai 2024
    Lesezeit
    3 Minuten
    Rubrik
    Events-tutorials

    All this was supplemented by the InnoElectro co-event, the IOT LIVE SHOW, and the Solution Provider Competition, extending over an additional 700 square meters with 21 exhibitors. The exhibition also celebrated the anniversaries of two MELT member companies: Danutek for 20 years and Microsolder for 30 years.

    Grand prize

    For the second time, MELT awarded the InnoElectro Grand Prize at the exhibition. The professional jury, including Dr. Károly Kazi, President of NESH and CEO of BHE Bonn Hungary Ltd., Dr. László Ábrahám, CEO of Sensiron Ltd., President of the Alliance for the Future of Engineers, and Dr. László Pap, Professor Emeritus at the BME Faculty of Electrical Engineering and Informatics, awarded the InnoElectro Grand Prize to InterElectronic Hungary Ltd. in 2024. The winning product was the Europlacer ATOM ii-A2 multifunctional component placement machine. The second place went to Phoenix Contact‘s Single Pair Ethernet (SPE) solution, while Endich Bauelemente received third place for their development of a modular, extensive, ad-hoc WLAN smart sensor network ecosystem with self-endpoints, gateways, and cloud services.

    Roundtables

    In the EMS panel discussion, experts highlighted that the greatest strength of Hungarian assembly companies lies in their specialized knowledge, experience, and innovative thinking, which can provide significant added value for customers in small-series production. Participants included József Medgyesi (Elektromont), Árpád Méhész (Silveria), Gyula Ulrich (Z Elektronika), and Miklós Melchardt (Dynamic Csurgó).

    The participants in the roundtable discussion on professional media (Miklós Imre – Invest Marketing Publisher, Tamás Véghely – EU-SOLAR Plc., Miklós Czakó – New Technology Magazine, Miklós Lambert – MELT Media Section, Zoltán Kiss – Endrich Bauelemente) emphasized the importance of Hungarian-language professional literature.

    The most interesting R&D roundtable discussion participants were László Ábrahám (Sensirion), Károly Kazi (BHE-Bonn Hungary), János Lazányi (PCB Design), and László Naszádos (thyssenkrupp). Renowned experts in the Hungarian electronics industry cautioned against the Hungarian government‘s overly optimistic plans to place the country among the top 10 innovators in the coming decades. They highlighted the contradictions between ambitious goals, available resources, governmental measures, and the increasingly acute shortage of engineers, emphasizing the importance of education. They also emphasized that many Hungarian companies have significant innovation potential and achieve excellent results internationally.

    Soldering competition

    For the third time, NESH organized a hand soldering competition for high school students to bring young people closer to the beauty of the electronics industry and electrical engineering profession. A total of 100 students from 25 schools participated in the competition. Levente Baltás (Kandó Kálmán Technical School, Kecskemét) took first place, followed by Bálint Nándori (Újpest Technical School, Budapest) in second place, and Levente Szilágyi (Beregszász Technical School and College, Debrecen) in third place. Bálint Nándori (Újpest Technical School, Budapest), Olivér Forgó, and Dávid Kovács-Kalocsa, both students of Bányai Júlia High School in Kecskemét, received special prizes. The best team award went to the Bánki Donát Technical School in Nyíregyháza.

    melt-forrasztasi-verseny-dijatado-foto-credit-polyak-attila.jpg

    IPC regional qualification

    Traditionally, InnoElectro hosts the Hungarian qualification competition for the IPC Hand Soldering World Championship. The top three contestants received cash prizes, with the winner traveling to Munich for the electronica Exhibition to represent Hungary at the World Championship. Once again, Zsombok Péter from BHE Bonn Hungary took first place in a tight competition – for three consecutive years now. He was followed by Tibor Hermann (BME) in second place and Zoltán Vizi, an employee of TI-Electronics Ltd., in third place. The best team title this year went to TI-Electronics Ltd.

    2025 event

    InnoElectro will open its doors to professionals in Budapest from 8-10 April 2025.

    www.melt.hu

    www.innoelectro.hu

    Mehr aus Events-tutorials

    Weitere aktuelle Artikel aus der Rubrik Events-tutorials.

    Alle Events-tutorials-Artikel
    Call for abstracts for Amsterdam conference
    Events-tutorials

    Call for abstracts for Amsterdam conference

    19. Mai 2026

    Call for abstracts for Amsterdam conference, Next-generation electronics design and innovation

    Concurrent forums at productronica China 2026
    Events-tutorials

    Concurrent forums at productronica China 2026

    26. Januar 2026

    Concurrent forums at productronica China 2026

    Energy-efficient, high-reliability solder solutions
    Events-tutorials

    Energy-efficient, high-reliability solder solutions

    10. September 2025

    Indium Corporation has announced that it will exhibit a range of sustainable, high-reliability solder products at productronica India, which is set to

    InnoElectro 2025 attracts record attendance
    Events-tutorials

    InnoElectro 2025 attracts record attendance

    14. Mai 2025

    Electronics industry event

    ← Zurück zu Events-tutorialsZur Startseite