The platform consists of Indium8.9 Series solder pastes using the company’s patent-pending solder paste technology for board-side interconnect, and SACM solder balls (spheres) for package-level interconnect. The halogen-free, Pb-free solder paste is one of the standard flux vehicles for SACM. Indium8.9HF provides excellent soldering performance under high temperature and long reflow processes. It offers unprecedented stencil print transfer efficiency to work in the broadest range of processes.
Also the company announces a new solder paste technology. BiAgX is a high-melting lead-free (Pb-free) solder paste technology designed for high reliability electronics assembly applications. Designed as a drop-in replacement for standard high Pb-containing solder pastes, it has passed MSL1 and thermal cycle testing at several power semiconductor customers. The solder paste technology is excellent for small, low-voltage QFN packages that are used in portable electronics, automotive electronics, and industrial applications. It excels in high temperature environments in excess of 150°C. It requires minimal process adjustments and no capital expenditures for customers converting from a standard high Pb-containing solder paste-based process. It addresses both customer demands and potential legislative changes that eliminate lead from high-melting die-attach applications. It is both Pb-free and Sb-free (lead and antimony) and does not contain costly specialty materials, such as nanosilver or sintering aids. The solution reflows, solders, wets, and solidifies just like any other solder paste, and is available in both dispense and printing forms. Fluxes are cleanable with standard cleaning chemistries and processes.
