This solder flux offers low residue for excellent board cosmetics and pin-testability for lead-free and tin-lead applications.Fully lead-free capable, this solder flux leaves minimal colorless, non-tacky, clear flux residue that spreads uniformly over the surface of printed circuit boards.
It provides excellent resistance to connector bridging across a broad range of process conditions. It is compatible with all common pad finish types and improves yield by reducing defects, minimizing rework, and increasing throughput.
EPP EUROPE 438
