Steffen Koetter, Product Manager for Wedge Bonding products from the Bonding Wire Business Unit of Heraeus states “with the potential of increasing the reliability of power modules, the novel material composition will play an import role in the future bonding wire technology, supporting the recent trend towards higher power density in Power Electronic Packages.”
The good bondability of the wire is achieved by the softness of the aluminum coating. At the same time, the copper core provides excellent electrical and thermal properties.
Furthermore, the Al/Cu structure enables reliable bonding windows without changing the chip metallization. CucorAl has been designed to be used with conventional bonding equipment. The wire can be applied to both, diodes and IGBTs.
The copper proportion of this thick wire is between 60 to 70 percent by volume. The new product is available in diameters from 200µm to 500µm.
