The contact pins are reportedly made from high-quality materials to deliver low-noise signals for maximum cell charge. In addition, the stainless steel/gold plated spring-probe contact are claimed to provide accurate repeatability for longer insertion life, up to 6 times that of low-performance burn-in test sockets with decreased maintenance schedules.
The company is able to deliver the sockets within days of customer-order receipt. This applies to most existing or new semiconductor-vendor designed 0.8 mm pitch BGA packages up to 15 x 15 mm and 216 pin grid.
From the use of these sockets the company expects efficiency gained through simplified inventory management, lower overall socket costs, reduced production variation and scrap costs, and less rework.
EPP EUROPE 448
