This solder paste is an air reflow, no-clean, halogen-free, Pb-free with a flux chemistry engineered to improve reliability with:
- High ECM performance under low standoff components, RF shields without proper ventilation, and components in low-clearance cavities
- Solder beading minimization
- Very low bridging, slump, and solder balling
- Excellent wetting to a variety of common fresh and aged metallizations and surface finishes
- High print transfer efficiency with low variation
It is compatible with lead-free alloys such as SnAgCu, SnAg, and other alloy systems favored by the electronics industry. This solder paste is halogen-free per IEC 61249–2–21, test method EN 14582.
