Due to its outstanding activation system, the paste eliminates head-in-pillow defects that are critical in lead-free soldering of BGAs. Even with the smallest components, this paste does not show graping or defects. It provides perfect wetting conditions for the most reliable solder joints. The team has experts with decades of experience in all types of selective solder applications. Engineers are available to provide support whenever special attention is needed to optimize the process.
productronica, A4.570
