Zum Inhalt springen
EPP Europe
  • News
  • Products
  • Applications
  • Technology
  • Semiconductor
  • Inspection
  • Company News
  • Events
EPP Europe
  • Technology
  • Inspection (AOI/AXI)
  • Semiconductor Packaging
  • Company News
  • Products
  • Trade Shows & Events
    EPP Europe Newsletter
    The most important electronics-manufacturing news delivered to your inbox.

    Info

    • Impressum
    • Datenschutz
    • Barrierefreiheit
    • Datenschutzeinstellungen

    Kontakt zur Redaktion

    EPP EuropeKonradin Mediengruppe
    Ernst-Mey-Str. 8, 70771 Leinfelden-Echterdingen

    E-Mail: redaktion@konradin.de
    Folgen Sie uns
    EPP Europe
    © 2026 EPP Europe
    Startseite/Products/Artikel
    Gold-tin solder preforms for precision Die-Attach applications
    Bildquelle nicht angegeben
    Products

    Gold-tin solder preforms for precision Die-Attach applications

    Indium Corporation featured precision gold-tin (AuSn) solder preforms for die-attach which are designed for high-reliability applications, such as
    Veröffentlicht
    15. Juli 2016
    Lesezeit
    1 Minute
    Rubrik
    Products

    Gold-based solder has a high melting point, ranging from 280°C to 1064°C (depending on the alloy), making it compatible with subsequent reflow processes. This alloy has the highest tensile strength of any solder, ensuring high-reliability for joining and sealing. In addition, gold-based solders are resistant to corrosion, provide superior thermal fatigue resistance, and exhibit excellent joint strength. The company’s Pb-free and RoHS-compliant AuSn preforms are available in a variety of standard and custom-engineered designs.

    The precision manufacturing processes and technologies ensure repeatable success in a production process. In addition, the partners with die-bonding equipment manufacturers to ensure that its preforms are engineered to work with equipment from assembly through reflow.

    www.indium.com

    Mehr aus Products

    Weitere aktuelle Artikel aus der Rubrik Products.

    Alle Products-Artikel
    Heavy board options added to reflow soldering system
    Products

    Heavy board options added to reflow soldering system

    27. Mai 2025

    Provider of reflow soldering technology, Vitronics Soltec has launched new Heavy Board options for its Centurion 1240 reflow soldering system. This

    New 3D AXI platform provides clearer imaging
    Products

    New 3D AXI platform provides clearer imaging

    22. Januar 2025

    Test Research, Inc. (TRI) has announced the launch of its new 3D AXI TR7600FB SII system and emphasized that it has been designed to deliver clearer

    No-clean formula maximize the solderability
    Products

    No-clean formula maximize the solderability

    10. Januar 2025

    Indium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting

    Extensive program of testing options
    Products

    Extensive program of testing options

    10. Januar 2025

    Test Research, Inc. (TRI) will join the IPC APEX EXPO 2025 held at Anaheim Convention Center on March 18 – 20, 2025 at booth #2905 to show latest test and

    ← Zurück zu ProductsZur Startseite