Attendees are invited to visit the company’s booth (#B2939), where it will be showcasing its latest advancements in board-level assembly materials, underfill, die attach adhesives, wafer-level materials, optoelectronic materials, and thermal interface materials. The company’s team of experts will be available to discuss how its solutions address the evolving needs of the semiconductor and microelectronics market, with applications spanning automotive, military, aerospace, consumer electronics, telecommunications, and AI.
“SEMICON Southeast Asia is a pivotal event for connecting with key stakeholders in the region’s semiconductor ecosystem,” the company stated. “We are excited to showcase our latest innovations and collaborate with customers to develop solutions that drive the semiconductor industry forward.”
