Vi TECHNOLOGY, a provider of inspection solutions for PCB assembly, will exhibit at SMT Hybrid Packaging, scheduled to take place May 16–18, 2017 at the Messe in Nuremberg, Germany. The company will show its 5K3D AOI coupled with the PI Series 3D SPI and SIGMA Link to create a complete inspection solution for smart factories.
The company’s innovative process improvement software, SIGMA Link, coupled with two high performance systems, from the PI Series (3D SPI) and K Series3D (3D AOI) products families, drive PCBA process control in new ways. A new era in process control begins. The result is one integrated solution for automated optical inspection, with a live link between systems and smart interface to improve the SMT process and productivity.
For Smart Factories, the software is the essential element to combine all inspection data and transform them into valuable information for the users. This real-time interface ensures full traceability and enables interlocking of machines to automate SMT lines while driving yields to new levels, especially important for the automotive, aerospace and defense sectors.
The new 5K3D is a full 3D AOI based on laser technology with angled cameras combined with best-seller Spectro optical solution. This new-patented 3D AOI combination offers complete defect coverage with high precision metrology.
SMT Hybrid Packaging, Booth 4–240
