Alpha OM-535 is a low temperature paste with excellent drop shock resistance and electrical reliability for low temperature reflow applications. It produces excellent solder joint and flux residue cosmetics, even when using long/high thermal soaking.
“These pastes were developed to meet new printing challenges and performance demands”, said Traian Cucu, Global Product Manager for Solder Paste at Alpha Assembly Solutions, a part of the MacDermid Performance Solutions Group of Businesses. “Each has unique assets to quellreliability concerns. OM-353 has excellent transfer efficiency with small area ratios and ensures high pick-and-place yields and good self-alignment. The enhanced properties of low temperature SBX02 alloy combined with the advanced chemistry performance of OM-535 enables the formation of a better solder joint by improving the mechanical performance and cosmetics using low temperature process settings.”
