- High spatial resolution & oblique scanning capability: The company’s proprietary column architecture delivers spatial resolution down to 2nm, even at the low acceleration voltages appropriate for photomask screening. Moreover, the E5610 features a unique, electrically controlled tilt module that allows its beam to tilt by up to 15°, enabling users to perform 3D defect reviews.
- Highly stable, fully automatic image capture: Even when operating at high SEM magnification, the E5610 performs stable, fully automatic defect imaging at a high rate of throughput, thanks to its high-accuracy stage, charge control function, and contamination reduction technology.
- Compatible with mask inspection systems: The E5610 is compatible with mainstream mask inspection systems: the tool imports defect location data and automatically images the locations. It supports the industry standard KLARF (KLA Results File) format.
- Elemental composition analysis option: The E5610 features an optional EDS (energy dispersive X-ray spectrometry) module that performs elemental analysis – an advanced method of mapping mask blank defects.
