“Attaining lead-free reflow compatibility is not the only hurdle faced by underfills,” said Lynn Yanyo, Sales and Marketing Director for the LORD Electronic Boards and Components Industry Group. “Flip chip packages targeted for high-performance applications are rapidly increasing in functionality, complexity, size and I/O density. To ensure their reliable performance, an underfill encapsulant is needed to eliminate the failures caused by stress generated during flip chip operating cycles. The underfills also must be easy to apply and therefore must offer rapid and fault-free flow into the decreasing gap sizes and through the densely populated interconnect arrays under today’s flip chip ICs.”
The underfill materials are engineered to quickly flow into gaps less than 25 microns with minimal filler settling and no voiding, encapsulating the fully populated interconnect arrays with a reliable layer of protective polymer. Thermal shock and cycling reliability testing has reportedly shown that flip chips under-filled with the company’s newest materials are suitable for many flip chip applications including the harsh environments found in the automotive industry.
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