The Paraquda 4C pick-and-place system combines a large feeder capacity, fast programming and changeover while the machine is running, with the ability to quickly place any component from 01005 up to 3.15×2.75“ (80x70mm) including fine-pitch, BGA, CSP or flip chips. This series automatic pick-and-place machines are designed to fulfill the requirements of a high-mix SMT production. All SMD components are placed quickly, and are reproducible and reliable using modern placement technologies. The system features a three-stage conveyor with manual rail adjustment, and a tool changer with 1×36 positions and 14 nozzles. The high-resolution fly-by vision system is equipped with the latest Cognex SMD image processing technology, thus can detect any kind of component – even odd-shaped parts. It is operated by ePlace – the new standard in pick-and-place software. ePlace, the new software designed entirely by the company, is based on the eez-technology. It has been fully developed in .net, uses an integrated database and offers a modern, interactive, intelligent and intuitive tool for controlling all parameters.
Essemtec’s Tucano USC-V automatic stencil printer was designed based on experiences from solar wafer printing and metallization. It features a unique design with only one XY-drive for vision, PCB stopper, stencil cleaning system, stencil load and unload, and 2D inspection. The special design increases the reliability of the printer and simplifies maintenance. Additionally, the system requires less space than other printers with a 23.9×22.8“ (608x580mm) printing area on a footprint of only13.99ft2 (1.3m²). It uses fewer motors than other systems for its operation, and therefore, uses less drive control electronics and energy.
The company also exhibited its newly introduced semiautomatic printer with vision, the Fino, which is more than adequate for small to mid-size volumes. Intelligent control and the possibility for an alignment per two vision cameras combines high quality technologies within a small footprint with a 17.7×19.7“ (450x500mm) printing area. The printer accepts any size stencil frame up to 23×23“ (584x584mm) and offers quick changeover.
The Pantera-XV is designed for prototype and mid-size series manufacturing. The machine offers an ideal combination of speed, accuracy and wide application range and is capable of placing 6000components per hour. The machine features optical laser and vision centring, and can place all SMD components from 0201 up to 2×2“ (50x50mm). The systems top-down vision system recognizes fiducial marks automatically. It can be used for teaching and controlling after dispensing and placement. The large feeder capacity and the automatic identification of the intelligent feeders minimize changeover time and guarantee quality. All tape feeders are electrically driven and feeding pitch is programmable.
With a high-capacity 26“ wide heater module, the Zonda series offers unmatched flexibility in board handling. The oven may be fitted with an adjustable single-rail edge hold conveyor/ mesh belt combo to carry even the largest boards or multi-board panels (up to 20“ wide) through the oven. The Zonda series supports high-mix / medium-volume up to high-mix / high-volume throughput, at different speeds to accommodate the fastest pick-and-place systems while conserving valuable factory floor space. Rapid response times and precise temperature controls assure process uniformity, regardless of component density or board loading, with identical profile performance in either air or nitrogen.
